Board-to-Board Header at 2.00mm Pitch — 8 Positions, SMT
The 57202-G52-04LF: The 2.00mm pitch and 0.079" row spacing set the PCB footprint — at this density, the board layout engineer must route traces between the pads with a 0.3mm minimum trace/space rule to avoid shorting. Eight positions in two rows, all loaded — the BOM position count is fixed; no optional unloaded positions to work around. The 0.157" (4.00mm) mating pin length gives enough wipe for a reliable contact in a typical 5-8mm stack height. Surface-mount termination with tin-plated posts (78.7µin) — the solder joint is formed on the board pad, not through a plated hole, so the reflow profile must match the thermoplastic housing's peak temperature rating.
In a field-service connector that gets cycled once a month, that's over 40 years of service at the contact interface. The tin finish on the solder posts is adequate for a single reflow cycle; if the board goes through multiple reflow passes (e.g., double-sided assembly), the tin can re-oxidize and reduce wetting. The UL94 V-0 thermoplastic housing handles the soldering heat without flaming, but the peak temperature should stay under 260°C per the Minitek® process spec.