Amphenol ICC (FCI) Minitek® 2.00mm, dual-row unshrouded SMT header, 10 positions (5 per row), 0.079" pitch, gold GXT™ mating finish (30.0 µin), tin-post termination (2.00 µm), 2 A per circuit at 200 V AC/DC, push-pull fastening, UL94 V-0 thermoplastic.
| Parameter | Value |
|---|---|
| Series | Minitek® 2.00mm |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 200V (AC/DC) |
| Current rating | 2A (AC/DC) |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Parameter | Value |
|---|---|
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 10 |
| Row spacing - mating | 0.079\" (2.00mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.157\" (4.00mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 57202-G52-05LF: Surface-mount solder termination means the header sits flat on the board and reflows with the rest of the SMT passives — no through-hole wave step. The push-pull fastening keeps it simple for low-vibration board stacking.
No official cross-reference or direct replacement is listed; the Minitek 2.00mm series includes other position counts and plating options if the BOM allows a change.
All positions are loaded.