Amphenol ICC (FCI) Minitek® 2.00mm, Board to Board, Header, Male Pin, 22 Positions, 2 Rows, 0.079" (2.00mm) Pitch, Surface Mount, Solder, Unshrouded, Push-Pull, 2A, 200V, Black, UL94 V-0
| Parameter | Value |
|---|---|
| Series | Minitek® 2.00mm |
| Gender | Male Pin |
| Mounting type | Surface Mount |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 200V (AC/DC) |
| Current rating | 2A (AC/DC) |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 22 |
| Row spacing - mating | 0.079\" (2.00mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.157\" (4.00mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 57202-G52-11LF: The post finish is tin, 78.7 µinch thick, compatible with standard SMT solder processes. The 0.157" (4.00 mm) mating pin length provides a solid wipe before the push-pull retention seats.
Surface-mount termination eliminates through-holes, freeing routing space on inner layers and reducing board-side keep-out.
Surface mount — the termination is SMT solder, not through-hole. The board footprint uses only the top-layer pads; no plated through-holes are needed.