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Amphenol 57202-G52-24ALF — Pin Headers, Sockets & Housings

57202-G52-24ALF Amphenol ICC Minitek 2.00mm Header, 48-Pos

MPN57202-G52-24ALF
Active

Amphenol ICC (FCI) Minitek® 2.00mm header, order code 57202-G52-24ALF, 48 positions, dual row, 0.079" (2.00mm) pitch, 2 A (AC/DC), gold GXT™ mating contacts, surface-mount, solder termination.

$3.0839Ref. price · indicative, final on quote
Amphenol 57202-G52-24ALF datasheet (PDF)
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

57202-G52-24ALF key specifications
ParameterValue
SeriesMinitek® 2.00mm
TypeMale Pin
MountingSurface Mount
Connector typeHeader
Fastening typePush-Pull
Voltage rating200V (AC/DC)
Current rating2A (AC/DC)
Contact materialCopper Alloy
Insulation colorBlack
Insulation materialThermoplastic
Material flammability ratingUL94 V-0
StyleBoard to Board

All specifications

57202-G52-24ALF additional specifications
ParameterValue
PackageTape & Reel (TR)
FeaturesPick and Place
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.079\" (2.00mm)
Positions48
Row spacing - mating0.079\" (2.00mm)
Contact finish - postTin
Contact finish - matingGold, GXT™
Contact length - mating0.157\" (4.00mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

48-position board-to-board header

The 57202-G52-24ALF is the 48-circuit member of Amphenol ICC's Minitek 2.00mm header line, a dual-row unshrouded board-to-board header with push-pull fastening. It carries gold GXT mating contacts rated 2 A (AC/DC) at 200 V (AC/DC) and mounts surface-mount with solder termination.

Pitch and footprint

The 0.079" (2.00mm) pitch and row spacing set the board footprint for routing density. The unshrouded design and UL94 V-0 thermoplastic housing suit applications where the header sits inside an enclosure.