The 61698-302TRLF: This is a standard fine-pitch grid for signal-level interconnects, keeping the board routing dense without requiring micro-via fan-out. 26 positions are listed, but only 25 are loaded — one pin position is depopulated. Before committing the BOM line, confirm the mating receptacle expects 25 circuits, not 26. The unloaded position may be a keying feature or a design hold for future expansion.
Contact Finish and Current: What the Ratings Mean
The current ceiling is typical for a 2.00 mm pitch header — the narrow contact beam and housing geometry limit heat dissipation. For a 25-circuit assembly, the total current budget is 50 A distributed across the connector. The post (solder tail) finish is tin, 100.0 µinch (2.54 µm) thick — compatible with standard SAC305 solder profiles. No gold on the termination side, which avoids embrittlement in the solder joint.
No bulk tube option is listed for this order code.
Compared to the through-hole right-angle 58102-S61-08LF (16 positions, 15 µinch gold, bulk), the 61698-302TRLF offers 25 loaded positions in SMD format — a higher density for surface-mount assembly, but the 58102 series gives a right-angle option for board-edge routing. The shrouded 73347-704TRLF (4 positions, 30 µinch gold, SMD) is a different mating style — its 2-wall shroud protects the pins during blind mating. The 61698-302TRLF is unshrouded, so the pins are exposed and require careful alignment during board stacking. The 58102-G61-16LF (32 positions, 30 µinch gold, through-hole right-angle) carries thicker gold for higher cycle life. If your application needs more than 500 mating cycles, the 30 µinch option is worth the board-spin cost.