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67996-130HLF — Amphenol product photo

67996-130HLF BERGSTIK® II Header 30 Pos 2.54 mm

MPN67996-130HLF
Active

Amphenol ICC (FCI) BERGSTIK® II, 67996-130HLF, Board to Board Header, 30 Positions, 2.54 mm Pitch, Through Hole, Solder Termination, 3 A per Contact, 30.0 µin Gold Mating Finish, UL94 V-0

$1.9100Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

67996-130HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Current rating3A per Contact
Operating temperature-65°C~125°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions30
Row spacing - mating0.100\" (2.54mm)
Contact length - post0.095\" (2.41mm)
Overall contact length0.425\" (10.80mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Amphenol ICC (FCI) BERGSTIK® II, 67996-130HLF, Board to Board Header, 30 Positions, 2.54 mm Pitch, Through Hole, Solder Termination, 3 A per Contact, 30.0 µin Gold Mating Finish, UL94 V-0

Frequently asked questions

How does 67996-130HLF compare to 67996-120HLF?

The 67996-120HLF is the 20-position sibling in the same BERGSTIK® II family — identical pitch, current rating, gold thickness, and housing. The only difference is position count: 30 vs 20 circuits.