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67996-472 — Amphenol product photo

Amphenol ICC (FCI) 67996-472 BERGSTIK II Header

MPN67996-472
Active

Amphenol ICC (FCI) BERGSTIK® II header, order code 67996-472, 72 positions, dual row, 0.100" (2.54 mm) pitch, 3 A per contact, tin-plated mating contacts, through-hole, solder termination.

$1.1725Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

67996-472 Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Current rating3A per Contact
Operating temperature-65°C~125°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBulk
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions72
Row spacing - mating0.100\" (2.54mm)
Contact length - post0.095\" (2.41mm)
Overall contact length0.425\" (10.80mm)
Contact finish - matingTin
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

Board-to-board unshrouded header, 72 circuits

The 67996-472 is the 72-circuit member of the BERGSTIK® II unshrouded header line from Amphenol ICC (FCI). Rated 3 A per contact with tin-plated mating contacts, it uses a 0.100" (2.54 mm) pitch and dual-row layout with 0.100" (2.54 mm) row spacing. The UL94 V-0 black insulation handles -65°C to 125°C.

Position count across the BERGSTIK II range

Within the BERGSTIK II series the 67996-472's 72 positions sit among the highest position counts available — the pitch, row spacing, and through-hole footprint are shared across the series, so the position count is the primary selection axis for circuit matching.