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Amphenol 67997-140 — Pin Headers, Sockets & Housings

67997-140 BERGSTIK® II Header, 40 Pos, 0.100" Pitch

MPN67997-140
Obsolete

Amphenol ICC (FCI) BERGSTIK® II, 67997-140, unshrouded board-to-board header, 40 positions, 2 rows, 0.100" (2.54 mm) pitch, through-hole solder termination, 3 A per contact, 30.0 µin gold mating finish, UL94 V-0 black housing.

$8.0352Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Jul 2026

Specifications

67997-140 key specifications
ParameterValue
SeriesBERGSTIK® II
TypeMale Pin
MountingThrough Hole
Connector typeHeader
Fastening typePush-Pull
Current rating3A
Operating temperature-65°C~130°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board

All specifications

67997-140 additional specifications
ParameterValue
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions40
Row spacing - mating0.100\" (2.54mm)
Contact length - post0.120\" (3.05mm)
Overall contact length0.450\" (11.43mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Amphenol ICC (FCI) BERGSTIK® II, 67997-140, unshrouded board-to-board header, 40 positions, 2 rows, 0.100" (2.54 mm) pitch, through-hole solder termination, 3 A per contact, 30.0 µin gold mating finish, UL94 V-0 black housing.

Frequently asked questions

What is a suitable replacement for 67997-140?

No official pin-compatible replacement is listed on record from Amphenol ICC (FCI). The BERGSTIK® II series includes many active 0.100" pitch dual-row headers, but each must be checked for position count (40), pin length (0.230" mating, 0.120" post), and gold plating thickness (30.0 µin) to match the BOM. A board spin may be required if no exact-fit substitute is found.