Amphenol ICC (FCI) BERGSTIK® II, 67997-212HLF, unshrouded pin header, 12 positions, 2 rows, 0.100" (2.54 mm) pitch, through-hole solder termination, 3 A per contact, 15 µinch gold mating finish, UL94 V-0 black housing.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Parameter | Value |
|---|---|
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 12 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.450\" (11.43mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 67997-212HLF: The 0.120" solder post length leaves enough standoff for a clean solder fillet on the through-hole side, even on a 1.6 mm board.
No keying: the dual-row layout self-orients, but the board footprint must match the receptacle's row spacing (0.100" between rows).