Amphenol ICC (FCI) BERGSTIK® II, 67997-234HLF, Board to Board Header, 34 Positions, 0.100" (2.54mm) Pitch, Through Hole, Unshrouded, 3 A, UL94 V-0
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Parameter | Value |
|---|---|
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 34 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.450\" (11.43mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 67997-234HLF: The unshrouded design gives you direct access to the square pins for board-to-board stacking or wire-to-board mating with a matching receptacle. The UL94 V-0 housing keeps the assembly compliant for equipment inside an enclosure.
The pitch is 0.100" (2.54mm) on both the row spacing and the pin-to-pin spacing within each row.
It is unshrouded – the square pins are exposed, which allows direct mating with a standard receptacle or stacking in board-to-board applications.
The closest sibling is the 32-position 67997-232HLF, which shares the same pitch, plating, current rating, and series. The 40-position 67997-240HLF is also a match if you need more circuits.