54-Position Dual-Row Unshrouded Header – BERGSTIK II
The 67997-254HLF: The through-hole solder termination and 0.230" (5.84mm) mating pin length provide a stable board-to-board interconnect for mezzanine or right-angle stacking.

Amphenol ICC (FCI) BERGSTIK® II, 67997-254HLF, unshrouded through-hole header, 54 circuits, dual-row, 0.100" (2.54mm) pitch, 3 A, gold-plated phosphor bronze contacts, UL94 V-0 black housing.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 54 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.450\" (11.43mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 67997-254HLF: The through-hole solder termination and 0.230" (5.84mm) mating pin length provide a stable board-to-board interconnect for mezzanine or right-angle stacking.
It is a 54-position, dual-row header with all positions loaded. The pitch is 0.100" (2.54mm) on both the row and column spacing.
The BERGSTIK® II series includes other 54-position dual-row headers with the same pitch, but contact finish and plating thickness may differ – verify the BOM position before substituting.