Board-to-board unshrouded header, 72 positions
The 67997-372 is the 72-position member of Amphenol ICC's BERGSTIK® II unshrouded header line, a board-to-board interconnect. Rated 3 A per contact with a gold or gold GXT™ mating finish at 50.0 µin (1.27 µm) thickness, it carries signal-level currents in a dual-row 0.100" (2.54 mm) pitch layout.
Mating pin length and stack height
The 0.230" (5.84 mm) mating pin length and 0.100" (2.54 mm) insulation height set the mated stack height for board-to-board spacing. The 0.120" (3.05 mm) post length suits standard through-hole boards.
