18-Pin Dual-Row Header with 0.100" Pitch
The 67997-618: The dual-row layout at 0.100" row spacing gives you a compact 0.200" × 0.900" board footprint, and the unshrouded design keeps the z-height low for tight enclosures.
The 0.100" pitch sets the board routing density — two traces per channel between pads on a standard 1 oz copper layer, or one wide trace for higher current. For signal-level power distribution (sensors, logic, low-current loads), this is well within the safe operating area. The 0.230" (5.84mm) mating pin length and 0.100" (2.54mm) insulation height give a typical mated stack height around 0.330" (8.38mm) when paired with a standard BERGSTIK® receptacle — check the mating half's insulation height for exact z-height budget.