Molex BERGSTIK® II, 34-position dual-row unshrouded header, 0.100" (2.54 mm) pitch, through-hole solder, male pin, 5 A, gold-plated (30.0 µin) mating interface, UL94 V-0, 110 V.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 110V |
| Current rating | 5A |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 34 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.107\" (2.71mm) |
| Overall contact length | 0.525\" (13.34mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.318\" (8.08mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The Molex BERGSTIK® II 67998-134 is a 34-position, dual-row unshrouded header with a 0.100" (2.54 mm) pitch — a standard board-to-board interconnect for through-hole solder termination.
The 34-position count means every circuit on the BOM line gets its own pin — no loading options to check. The 0.100" pitch and 0.100" row spacing are the industry-standard footprint for 2.54 mm grid boards, so the board layout matches off-the-shelf prototyping grids and existing BERGSTIK II receptacle patterns.
Contact the storefront with your BOM for a same-day quote.
The 67998-134 carries an Active lifecycle status — full production, no end-of-life notice.
The 67998-134 is a 34-position, dual-row header on a 0.100" (2.54 mm) pitch with a 0.100" row spacing — all positions loaded.
The current rating is 5 A per circuit, and the voltage rating is 110 V.
This unshrouded header mates with standard 0.100" pitch BERGSTIK II receptacle housings and compatible IDC socket connectors from the same series.