It uses the classic 0.100" (2.54mm) square grid — the same pitch on both rows and between rows — which means the board footprint is a standard 0.100" x 0.100" pattern, easy to route and widely supported by prototyping boards and IDC ribbon cable receptacles. Rated 5 A per contact at 110 V, with gold or GXT™ plating at 15.0 µin (0.38 µm) on the mating surface, this header is built for repeated mating cycles in signal-level board-to-board or wire-to-board interconnects. The UL94 V-0 black housing and phosphor bronze contacts round out the spec for general-purpose use inside equipment enclosures.
The 36 positions, all loaded, mean the BOM line count is exactly 36 circuits. The unshrouded design keeps the profile low: the insulation height is only 0.100" (2.54mm) above the board surface, and the overall contact length of 0.525" (13.34mm) splits into a 0.318" (8.08mm) mating section and a 0.107" (2.71mm) solder tail. Tin-plated headers at this pitch are cheaper but wear out faster under repeated mating. For a one-time permanent solder joint, tin would do; for a connector that gets mated and unmated, this plating grade is the right call.