Board-to-Board Header for Dual-Row Layouts
The Amphenol ICC (FCI) 67998-238HLF is a 38-position, dual-row unshrouded header from the BERGSTIK® II series. It uses a standard 0.100" (2.54mm) pitch and row spacing, making it a direct fit for legacy and new dual-row board-to-board layouts. The through-hole solder termination and 0.107" (2.71mm) post length suit it for standard PCB thicknesses. Rated at 5 A per circuit with a 110 V voltage rating, it handles moderate signal and low-power distribution duties. The 15.0 µin gold plating on the mating surface provides reliable contact over repeated mating cycles in controlled environments.
What the Key Ratings Mean for Your Build
The 0.100" pitch is the defining footprint dimension — it matches the industry-standard grid for prototyping and production boards, keeping routing density predictable. The 5 A per-contact rating is typical for a signal-grade header; derate it above room temperature per the manufacturer's curve. The 15.0 µin gold plating is the key spec for mating cycle life — it supports hundreds of insertions without exposing the base phosphor bronze, which matters if the board goes through test or rework. The UL94 V-0 housing means the header is acceptable for equipment inside an enclosure requiring a flame rating.