Product Introduction
This dual-row, through-hole header uses a standard 0.100" (2.54mm) pitch on both rows and between rows, making it a drop-in fit for the ubiquitous 0.100" grid footprint. The square pins are gold-plated to 15.0µin (0.38µm) on the mating surface, rated for 5 A per contact at 110 V.
The 0.100" (2.54mm) pitch is the de facto standard for unshrouded headers — it matches the legacy Berg / AMP / Molex footprint and gives enough room for one trace between pads on a standard 2-layer board.
Board-to-Board Stacking and Mating
This header is listed as a board-to-board style connector. The overall contact length of 0.525" (13.34mm) and mating length of 0.318" (8.08mm) set the stack height between parallel boards — the post length of 0.107" (2.71mm) determines how far through the mating board the solder tail protrudes. For a typical mezzanine stack, the board-to-board gap will be the sum of the header's insulation height (0.100") plus the receptacle's height, minus the pin penetration depth. The push-pull retention is friction-only — no locking latch, so the assembly relies on the solder joints and any secondary mechanical fixation for vibration resistance.