Product Introduction
The FCI 67998-430HLF is a 30-position, dual-row unshrouded header from the BergStik® II series, designed for board-to-board interconnect applications. It uses the standard 0.100" (2.54 mm) pitch and row spacing, making it footprint-compatible with a wide range of mating receptacles and IDC connectors. The through-hole solder termination and push-pull fastening suit it for permanent PCB installations where the mating half is not frequently disconnected.
Key Specifications and What They Mean for Your Design
The 30 positions are fully loaded across two rows, so the BOM line count matches the circuit count directly — no unpopulated positions to account for. The 0.100" pitch is the de facto standard for BergStik headers, giving you a dense but routable footprint on a 2-layer board. Rated 5 A per contact with a 110 V voltage rating, this header handles signal and low-power distribution. The tin-on-tin contact system (100.0 µin tin on the mating side, tin on the post) is cost-effective for applications with a limited number of mating cycles — think one-time assembly or occasional rework. For frequent disconnect/reconnect duty, a gold-plated variant in the same series would be the better call. The UL 94 V-0 rated black housing and phosphor bronze contacts are standard for equipment inside an enclosure where flame retardance is required. The 0.100" (2.54 mm) insulation height keeps the mated stack height low — typical for mezzanine or parallel-board spacing where the mating receptacle has a matching profile.