BergStik II 50-Position Unshrouded Header
It's a through-hole, board-to-board interconnect with a standard 0.100" (2.54mm) pitch on both rows and between rows. The unshrouded design means there's no keying or polarisation — the mating receptacle relies on the board layout for alignment, so double-check the footprint before committing.
The 0.100" (2.54mm) pitch is the industry-standard BergStik footprint — it matches legacy layouts and accepts the matching IDC or crimp receptacle. The 100.0 µ" (2.54 µm) tin plating on the mating surface is thick enough for dozens of mating cycles in a clean indoor environment, but it's not rated for high-cycle or corrosive duty where gold would be specified. The 0.100" (2.54mm) insulation height and 0.318" (8.08mm) mating pin length set the stack height when mated with a standard BergStik receptacle — the overall contact length of 0.525" (13.34mm) includes the post length for the through-hole solder joint.