The 68000-109HLF: It is designed for board-to-board interconnects where a low-profile, through-hole solder connection is required. The gold thickness on the mating face is specified at 30.0 µinch (0.76 µm), which provides a durable interface for field-service applications where the connector may be cycled several times over the product life.
This header mates with unshrouded female socket connectors that accept 0.025" square pins on 0.100" pitch.
