36-Position Single-Row Header for Board-to-Board Stacking
The 15.0 µinch (0.38 µm) gold thickness on the mating area provides corrosion resistance and supports 500+ mating cycles in field-service or test-fixture use.
Unshrouded Design and Mating Half
This stack height works for parallel board spacing where the mating receptacle adds its own height — typical for mezzanine or card-edge stacking.
The square pin (0.025" typical) provides good solder joint strength and aligns with the plated through-hole.