Amphenol ICC (FCI) BERGSTIK® II, 68001-103HLF, Board to Board, Header, Male Pin, 3 Positions, 0.100" (2.54mm) Pitch, Through Hole, Solder, Unshrouded, Push-Pull, 3A per Contact, 30.0µin Gold Mating Finish, UL94 V-0, -65°C~125°C, RoHS
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Parameter | Value |
|---|---|
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 3 |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.450\" (11.43mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 68001-103HLF: The unshrouded design leaves the square pins exposed — the mating receptacle provides all the alignment, so the board layout should allow for some lateral play during assembly.
With 3 positions loaded, the header occupies just 0.300" of board edge, leaving room for other components in a tight layout.
In a test fixture that sees daily connector swaps, that plating buys years of reliable contact resistance.
The mating pitch is 0.100" (2.54mm), which is the standard spacing for legacy prototyping and many board-to-board receptacles.
It is unshrouded — the pins are exposed with no plastic shroud around them. The mating receptacle provides all alignment, so the board layout should allow for some lateral play.
Rated at 3 A per contact.
The 68001-104HLF is the 4-position sibling — identical pitch, plating, current rating, and unshrouded single-row layout. If your BOM needs one more circuit, that's the direct swap.