Amphenol ICC (FCI) BERGSTIK® II, 68001-136HLF, Board to Board, Header, Male Pin, Solder, Through Hole, 36 Positions, 0.100" (2.54mm) Pitch, Unshrouded, 3A per Contact, 30.0µin Gold Mating Finish, UL94 V-0, Black, Active.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 36 |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.450\" (11.43mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 68001-136HLF: The 30.0 µinch gold over nickel on the mating face is the same thickness used on the 13-position and 10-position siblings (68001-113HLF, 68001-110HLF). The 36-position variant with 15.0 µinch gold (68001-236HLF) is a lower-cycle-life alternative — half the gold thickness halves the rated mating cycles. For applications requiring frequent disconnect, the 30 µinch version is the correct choice.
The 68001-236HLF is the same 36-position, single-row, unshrouded header but with 15.0 µinch gold plating instead of 30.0 µinch. If mating cycle life is not critical, the 236HLF is a cost-reduction option.
No. The 68001-136HLF is an unshrouded header with push-pull fastening.