Amphenol ICC (FCI) BERGSTIK® II, 68002-210HLF, Board to Board, Header, Male Pin, 10 Positions, 0.100" (2.54mm) Pitch, Through Hole, Solder, Unshrouded, Push-Pull, Black, UL94 V-0, 3 A, -65°C~130°C, Gold or GXT™ plating 15.0µin
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 10 |
| Contact length - post | 0.150\" (3.81mm) |
| Overall contact length | 0.480\" (12.19mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The closest sibling is 68002-205HLF — identical pitch, plating, and overall length, but with 5 positions instead of 10. For a BOM that needs fewer circuits, the 5-position version saves board space without changing the footprint pattern. The 68000-210HLF shares the same 10-position count but has a shorter overall contact length of 0.425" (10.80 mm), which changes the mated stack height.
The mating pitch is 0.100" (2.54 mm), which sets the board footprint for the through-hole solder tails.
Sourced through independent distribution channels.