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68015-206HLF — Amphenol product photo

68015-206HLF Header – 6 Pos, 2.54 mm, Right-Angle, Gold

MPN68015-206HLF
Active

Amphenol ICC (FCI) BERGSTIK® II, 68015-206HLF – unshrouded male pin header, 6 positions, 0.100" (2.54 mm) pitch, right-angle through-hole, 3 A per contact, 15.0 µinch gold mating finish, UL94 V-0 black housing.

$0.5700Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

68015-206HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole, Right Angle
Connector typeHeader
Fastening typePush-Pull
Current rating3A per Contact
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.095\" (2.41mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows1
Pitch0.100\" (2.54mm)
Positions6
Contact length - post0.090\" (2.29mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - mating15.0µin (0.38µm)

Product details

Board-Edge Layout Fit

Comparing the 68015 and 68016 Siblings

The 68015-103HLF is the same 68015 base but with 3 positions and 30.0 µinch gold – double the plating thickness. Choose the 103HLF for applications needing higher mating cycle life or a more corrosive environment; the 206HLF covers standard signal duty.

Frequently asked questions

What is the closest functional second-source for 68015-206HLF?

The 68016-206HLF is a direct functional equivalent – same 6 positions, 0.100" pitch, right-angle orientation, gold plating, and UL94 V-0 housing. It is a drop-in replacement for the board footprint.