68021-424HLF — BERGSTIK II 24-Position Header, 3A, 0.100" Pitch
Amphenol FCI BERGSTIK II 68021-424HLF, dual-row 0.100 inch pitch header, 24 positions (2×12), right-angle through-hole, male pin, tin-plated contacts rated 3A per contact at 110V, -65°C to 125°C, UL94 V-0 black housing, push-pull fastening.
Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Type | Male Pin |
| Mounting | Through Hole, Right Angle |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 110V |
| Current rating | 3A per Contact |
| Operating temperature | -65°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.190\" (4.83mm) |
| Material flammability rating | UL94 V-0 |
All specifications
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 24 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.120\" (3.05mm) |
| Contact finish - mating | Tin |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
Frequently asked questions
Where can I buy the 68021-424HLF and how is it quoted?
The 68021-424HLF is sourced through independent distribution, quoted to order against your BOM quantity. Availability and current pricing are confirmed at quote time — no shelf stock or immediate-dispatch claim applies to this obsolete part.
What is the 68021-424HLF's listed style and series?
The listed style is Board to Board, and the part belongs to the BERGSTIK II series. It is a dual-row unshrouded header with 0.100 inch pitch and 24 positions.
What connector mates with the 68021-424HLF header?
The 68021-424HLF mates with any standard 0.100-inch pitch dual-row receptacle or IDC socket in the same series or compatible family. Confirm the receptacle's pin-entry depth matches the 0.230-inch mating pin length and that the locking mechanism suits the application's vibration and shock environment.