Board-to-Board Header for Through-Hole Layouts
The FCI 68022-126HLF is a 26-position, dual-row unshrouded header from the BERGSTIK® II series. It uses the industry-standard 0.100" (2.54 mm) pitch on both rows and between rows, matching the legacy DIP footprint grid that board layout engineers know well — no custom pad pattern needed. The right-angle through-hole orientation places the pin rows parallel to the PCB, suited for mezzanine stacking or board-edge I/O where vertical clearance is limited. Rated 5 A per contact with a 110 V voltage limit, this header handles moderate signal and low-power distribution duties. The mating contacts are finished with 30.0 µin of gold or GXT™ — a plating thickness that survives repeated mating cycles without exposing the phosphor bronze base metal, unlike thin flash gold that wears through quickly.
Mating and Termination
This unshrouded header accepts standard 0.100" pitch female socket housings — the matching BERGSTIK II receptacle or any industry-standard IDC socket with square pin receptacles. The 0.318" (8.08 mm) mating pin length provides enough engagement depth for most socket designs. Solder termination on 0.110" (2.79 mm) posts fits standard through-hole boards. The push-pull fastening type means no locking latch — the retention comes from the friction fit of the socket contacts on the square pins. For vibration-prone environments, a secondary retention method (like a wire-to-board housing with a latch) should be considered.