It uses a 0.100" (2.54mm) pitch on both rows and contacts, making it a standard-density board-to-board interconnect for parallel or right-angle PCB mating. Rated 5 A per contact at 110 V, with gold or GXT™ plating at 15.0 µin (0.38 µm) on the mating surface.
This header mates with any standard 0.100" pitch, dual-row, unshrouded receptacle housing that accepts 0.025" square pins — a common interface across the BERGSTIK II and compatible series. The 0.318" (8.08mm) mating pin length provides sufficient engagement depth for standard box-type receptacles. The 0.110" (2.79mm) solder post length is designed for through-hole soldering to the PCB; the right-angle bend places the pin rows parallel to the board surface.
Board Layout Notes
The 0.100" pitch and 0.100" row spacing define a standard 0.100" x 0.100" grid footprint. The 0.240" (6.10mm) insulation height above the board leaves clearance for trace routing under the header body. The right-angle orientation requires a keep-out zone on the approach side for the mating receptacle; the 0.110" post length dictates the solder fillet height on the bottom side of the board.