Amphenol FCI BergStik II 68022-222HLF, 22-position dual-row 0.100" pitch header, 5A per contact, right-angle through-hole, gold or GXT contact plating, 0.240" insulation height, UL94 V-0, bag packaging.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole, Right Angle |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 110V |
| Current rating | 5A |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.240\" (6.10mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 22 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.110\" (2.79mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.318\" (8.08mm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
Its 0.100" (2.54 mm) mating pitch matches the legacy DIP footprint, so the PCB layout uses a standard 0.100" grid — no special keep-out. All 22 positions are loaded, giving 11 pins per row for parallel signal buses or ribbon cable interfaces.
This is an unshrouded male pin header with push-pull fastening.
The 68022-222HLF is listed as Board to Board style — a dual-row header designed for through-hole board-stacking applications, not wire-to-board.