It uses a dual-row layout on a 0.100" (2.54 mm) pitch — the standard grid for prototyping and production backplanes.
The 42-position count is fully loaded across both rows — no skipped positions to save board space. The mating contact finish is gold or Gold, GXT™ at 15.0 µin (0.38 µm), which gives a solid wear surface for repeated mating cycles in a lab or field-service environment. Tin-plated tails on the solder side keep the cost down where the contact resistance of the solder joint dominates.