It uses a standard 0.100" (2.54 mm) pitch on both the mating interface and row spacing, making it footprint-compatible with a wide range of legacy and current board layouts.
Each square pin is phosphor bronze with a 100.0 µ" (2.54 µm) tin plating on the mating surface and tin on the solder tail — the heavy tin layer supports repeated insertion cycles in a moderate environment without the cost of gold. Rated 5 A per contact at 110 V, the current capacity is typical for signal-level and low-power distribution on a 0.100" grid. The unshrouded design gives direct access to the pins for probing or wire-wrapping, but leaves the contacts exposed — the mating receptacle must provide the polarization and strain relief.