Board-to-board header for through-hole assembly
It uses a 0.100" (2.54 mm) pitch — the standard DIP spacing — so the board footprint matches legacy layouts without a layout change. Contacts are male square pins in phosphor bronze with a 100.0 µin (2.54 µm) tin finish on the mating surface. That is a heavy tin plate — good for a few dozen mating cycles in a low-insertion environment, but not a high-cycle gold application. The tin post finish matches the solder side for a consistent solder joint. Rated 5 A per contact at 110 V, with a UL94 V-0 black housing. The 5 A figure is typical for signal-level interconnects on a 0.100" pitch — the current is limited by the single-row pin density and the ambient temperature, not the contact itself.