It uses a 0.100" (2.54mm) pitch and through-hole right-angle mounting, making it a standard footprint for board-to-board interconnects where the header sits flush to the PCB edge. Rated 5A per contact at 110V, with a UL94 V-0 housing.
Compared to a 10-position BergStik II header at the same 0.100" pitch, the 25-position 68023-425HLF adds 15 circuits in the same single-row layout — the board footprint just extends linearly. The tin finish on both mating and post sides means this is the cost-optimized variant within the series; the gold-plated siblings (e.g., 68023-225HLF with 15.0µin gold) are the choice for corrosive environments or repeated mating cycles. For a one-time board-to-board connection inside an enclosure, the tin-on-tin interface is adequate and saves roughly 30-40% over the gold option in the same position count.