It uses a 0.100" (2.54mm) pitch and through-hole solder termination, making it a standard board-to-board interconnect for parallel PCB stacking or wire-to-board via a mating receptacle. The unshrouded design means there's no keying or polarization — orientation is set entirely by the board layout and the mating half. The mating contact finish is specified as Gold or Gold, GXT™ at 30.0µin (0.76µm) thickness, which provides reliable corrosion resistance and consistent contact resistance over repeated mating cycles — a solid choice for environments where the board may see field service or multiple insertions. The housing is rated UL94 V-0, and the overall contact length of 0.513" (13.03mm) breaks down to a 0.230" (5.84mm) mating length and a 0.183" (4.65mm) solder post. All 14 positions are loaded. The black insulation height is 0.100" (2.54mm) above the board surface.
Within the BERGSTIK® II family, the 68031-114HLF shares the same 0.100" pitch, single-row layout, and unshrouded profile as other 68031-series headers. The differentiating spec is the 14-position count — a middle-ground option between, say, a 10-position and a 20-position member of the same series.