Amphenol Dubox 68046-325LF, 50-Position 0.100" SMT Receptacle
Amphenol Dubox™ 68046-325LF: 50-position dual-row board-to-board receptacle, 0.100" (2.54 mm) pitch, surface-mount, push-pull latching, 1000V rated, gold-on-mating contacts with tin-plated posts, PPS glass-filled insulation rated UL94 V-0, -65 to 125 °C operating range, supplied in tube.
Specifications
| Parameter | Value |
|---|---|
| Series | Dubox™ |
| Type | Female Socket |
| Mounting | Surface Mount |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Voltage rating | 1000V |
| Operating temperature | -65°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.310\" (7.87mm) |
| Insulation material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material flammability rating | UL94 V-0 |
All specifications
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Tube |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 50 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Frequently asked questions
What does the dual plating (gold mating, tin post) on the 68046-325LF mean in practice?
The gold or Gold GXT™ plating at 30 µin on the mating face delivers low contact resistance and durability at the plug interface; the 100 µin tin plating on the solder posts protects and wets the solder joint during reflow. The split is the standard Dubox durability-versus-solderability tradeoff.
What is the insulation height of the 68046-325LF, and why does it matter?
The insulation body stands 0.310 inches (7.87 mm) above the board surface — this is the standoff height the mated board pair must accommodate, and both boards need clearance past the connector body during reflow and thermal cycling.