68046-613
Molex Dubox 68046-613, 26-Position, 1000V Board-to-Board Receptacle
MPN68046-613
Active
Molex Dubox 68046-613, 26-position, dual-row board-to-board receptacle, 0.100 inch pitch, gold-plated mating contacts / tin-plated solder tails, 1000V, 3A rated, surface-mount push-pull termination, PPS housing, -65°C to 125°C operating range.
$3.1895Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Jul 2026
Specifications
| Parameter | Value |
|---|---|
| Series | Dubox™ |
| Type | Female Socket |
| Mounting | Surface Mount |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Voltage rating | 1000V |
| Operating temperature | -65°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.310\" (7.87mm) |
| Insulation material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material flammability rating | UL94 V-0 |
All specifications
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Tube |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 26 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Frequently asked questions
What connector series is the 68046-613 part of?
The 68046-613 is a member of the Molex Dubox series, a dual-row board-to-board connector family with push-pull latching and 0.100 inch pitch.
What is the contact plating configuration on the 68046-613?
Gold or Gold GXT plating on the mating interface at 30 µin thickness, with tin on the solder tails at 100 µin — the gold side handles durability at the mate/unmate interface; the thick tin post survives multiple reflow cycles during board assembly.