It sits on a 0.100" (2.54 mm) square grid — matching the industry-standard 0.100" pitch and row spacing — so the footprint is a drop-in for any 0.100" dual-row header pattern. Rated 5 A per contact at 110 V, with gold or GXT™ plating at 30.0 µ" (0.76 µm) on the mating surface, it is built for repeated mating cycles in a clean, board-to-board signal interconnect.
The 0.100" pitch and row spacing set the board layout — the 4 positions in 2 rows occupy a 0.200" x 0.100" footprint, and the 0.095" (2.41 mm) post length is sized for a standard 0.062" PCB with enough tail for a solid solder fillet. The 30.0 µ" gold/GXT plating gives this header a mating-cycle life well beyond a tin-plated equivalent — relevant if the board sees multiple disconnect/reconnect cycles during test or field service. The UL94 V-0 housing and push-pull fastening type mean this is a non-latching, unshrouded header intended for internal board-to-board connections where vibration is controlled and the mating pair is secured by the enclosure or a secondary mechanical lock.