The 68405-150HLF is a 50-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board signal interconnect. It uses a 0.100" (2.54 mm) square-pin grid on both pitch and row spacing, matching the standard DIP footprint layout for through-hole soldering. The right-angle orientation places the pin rows parallel to the board edge, which suits mezzanine or perpendicular card stacking where the connector sits at the board perimeter. Rated 5 A per contact, the current capacity is typical for signal-level duty — the 30.0 µin gold plating on the mating surface supports repeated mating cycles without contact fretting.
Within the BERGSTIK® II family, the 68405-150HLF is the 50-position, right-angle variant. The same series also includes straight through-hole headers at the same 0.100" pitch — the choice between right-angle and vertical depends on whether the cable or board exits parallel or perpendicular to the motherboard. The unshrouded design means the male pins are exposed after mating, so the mating receptacle must provide full pin coverage; a shrouded header from the same pitch family would add a plastic wall around the pins for mechanical protection.
This unshrouded header mates with any standard 0.100" pitch IDC socket or crimp receptacle that accepts a 0.025" square pin. The 2.54 mm row spacing is common across the BergStik ecosystem, so a dual-row receptacle with 50 positions and the same pitch will fit. The push-pull fastening type means no locking latch — retention relies on the friction of the pin-socket interface.