68-Position BERGSTIK II Header for Board-to-Board Stacking
The Amphenol FCI 68405-168HLF is a 68-position dual-row male header from the BERGSTIK II series, designed for board-to-board interconnect applications. It uses a 0.100" (2.54 mm) pitch on both the pin and row spacing, matching the standard 0.100" grid common in prototyping and production backplanes. The right-angle through-hole orientation places the pin axis parallel to the PCB, which suits board-edge mating or mezzanine stacking where the connector sits flush against the board surface. The unshrouded header uses a push-pull fastening mechanism, meaning the mating receptacle relies on friction from the pin-to-contact interface rather than a locking latch. Gold or GXT plating on the mating surface, at a minimum thickness of 30.0 µin, provides corrosion resistance and supports repeated mating cycles typical of test fixtures or modular assemblies. The phosphor bronze contact material offers good spring properties for consistent normal force over the life of the connection. Rated at 5 A per circuit at 110 V, the current capacity is typical for a 0.100" pitch header and is limited by the temperature rise of the housing material. The UL94 V-0 black housing meets the flammability rating required for equipment inside an enclosure, and the 0.190" (4.83 mm) insulation height provides adequate creepage distance for the 110 V working voltage in clean, dry environments.
Board Layout and Mating Considerations
The 0.095" (2.41 mm) post length is sized for standard PCBs, with the solder tail protruding enough for a reliable through-hole solder joint. All 68 positions are loaded, so the footprint requires a full 2x34 through-hole pattern on 0.100" pitch with 0.100" row spacing. The unshrouded design means the header has no plastic wall around the pins, which allows the mating receptacle to self-align during blind mating but provides no keying — the assembler must ensure correct orientation before press-fit or soldering.