The Amphenol FCI 68405-172HLF is a 72-position dual-row male header from the BERGSTIK® II series, on the standard 0.100" (2.54mm) pitch. The mating contacts are phosphor bronze with a 30.0µin (0.76µm) gold finish, giving it the cycle life for repeated mating in board-to-board applications where the header is soldered into one PCB and mates with a matching receptacle on another.
Board layout and footprint
The 0.100" row spacing matches the pitch, so the 72 pins occupy a 36-position-per-row grid. The right-angle orientation puts the pins parallel to the board surface, with the mating interface extending 0.230" (5.84mm) from the insulator face and the solder tails projecting 0.095" (2.41mm) below the board. That short post length keeps the through-hole pad depth shallow, which helps with routing density on inner layers. The unshrouded design means no plastic wall around the pins — the board layout needs to account for the exposed pins, but the profile stays low at a 0.190" (4.83mm) insulator height.
The 30.0µin gold on the mating surface is a heavy plating — well above the 15 µin threshold for corrosive environments or frequent mating cycles. For a signal-level header like this, the gold layer prevents oxidation on the contact interface over years of service in industrial cabinets or telecom racks. The 5 A per circuit rating is typical for 0.100" pitch signal headers; the real current limit in a dense 72-position build will be set by the total bundle current and the derating above ambient, not the per-contact spec.
There is no official cross-reference from TE or Molex on record for this exact BERGSTIK II configuration.