Board-to-Board Header, BergStik II Series
It uses a 0.100" (2.54 mm) square grid pitch common to standard BergStik headers, making it a direct footprint match for legacy board-to-board and wire-to-board interconnect layouts. Tin plating on both the mating contact and the solder post keeps the per-unit cost low, though the 100.0 µin (2.54 µm) thickness on the mating side gives it more reconnection cycles than a thin flash tin finish. The header is rated 5 A per contact at 110 V, with a UL94 V-0 rated black housing.
No official replacement or cross-reference part number is provided by the manufacturer on record for the 68405-410HLF. For a drop-in footprint match, look for other BergStik II or BergStik series headers with the same 0.100" pitch, 10 positions, dual rows, and right-angle through-hole mounting — but verify the contact finish and overall length against your assembly before committing.
Fit and Key Specs
The 0.100" (2.54 mm) pitch and row spacing are the standard BergStik grid, so the board footprint is well-established. The right-angle orientation places the pin tips 0.230" (5.84 mm) from the board surface, with a post length of 0.095" (2.41 mm) for the solder joint.