Board-to-board header, 32 positions, 0.100" pitch
The 68533-012: Tin-plated mating contacts with 120.0 µin (3.05 µm) thickness suit moderate-cycle-count applications where cost per position is a priority over gold-plating cycle life.
Amphenol ICC (FCI) BergCon® header, order code 68533-012, 32 positions, dual row, 0.100" (2.54 mm) pitch, through-hole, tin-plated mating contacts, shrouded 4-wall, solder termination.
| Parameter | Value |
|---|---|
| Series | BergCon® |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.755\" (19.18mm) |
| Style | Board to Board |
| Package | Tray |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Parameter | Value |
|---|---|
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 32 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.103\" (2.62mm) |
| Overall contact length | 0.810\" (20.57mm) |
| Contact finish - mating | Tin |
| Contact length - mating | 0.275\" (6.99mm) |
| Contact finish thickness - mating | 120.0µin (3.05µm) |
The 68533-012: Tin-plated mating contacts with 120.0 µin (3.05 µm) thickness suit moderate-cycle-count applications where cost per position is a priority over gold-plating cycle life.
The style is Board to Board and the series is BergCon®.