Amphenol ICC (FCI) BERGSTIK® II, 68602-110HLF, 10-position, 2-row, unshrouded pin header, 0.100" (2.54 mm) pitch, through-hole solder termination, 3 A per contact, 30 µinch gold or GXT™ mating finish, UL94 V-0 black housing.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 10 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.150\" (3.81mm) |
| Overall contact length | 0.480\" (12.19mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 68602-110HLF: The 0.100" row spacing matches standard 0.100" grid prototyping and production boards, allowing direct replacement in legacy BERGSTIK® II layouts without board respin.
Unshrouded design allows the header to sit flush with the board edge, minimising z-height for space-constrained enclosures.
Sourced to order against your BOM quantity. Availability and current pricing confirmed at quote time — submit an RFQ for this line item.