Through-hole unshrouded header, 20 positions
The 68602-120HLF is the 20-position member of Amphenol ICC (FCI)'s BERGSTIK II unshrouded header line, dual-row, 0.100" (2.54 mm) pitch. Rated 3 A per contact, the header carries gold or gold GXT plating on the mating surface at 30.0 µin (0.76 µm) thickness and terminates through-hole with solder.
Board fit and routing density
The 0.100" (2.54 mm) pitch and 0.100" (2.54 mm) row spacing define a standard grid footprint that matches legacy 0.100"-center board layouts. The unshrouded push-pull interface keeps the profile low at 0.100" (2.54 mm) insulation height, allowing dense component placement adjacent to the header. The 0.230" (5.84 mm) mating pin length and 0.150" (3.81 mm) solder post length suit boards up to 0.062" (1.57 mm) thick; the overall contact length of 0.480" (12.19 mm) provides a stable through-hole solder joint.
Material and temperature range
Phosphor bronze contacts, black UL94 V-0 rated insulation, and an operating temperature range of -65°C to 130°C qualify the header for industrial and commercial environments where flame rating and wide thermal tolerance are required.