The 68602-124HLF: This footprint is the baseline for a wide range of mating IDC sockets, ribbon-cable connectors, and board-to-board receptacles — the pitch sets the board routing density and the per-contact current ceiling.

68602-124HLF Amphenol ICC (FCI) BERGSTIK® II Header 24 Pos
Amphenol ICC (FCI) BERGSTIK® II, 68602-124HLF, Board to Board Header, 24 Positions, 0.100" (2.54mm) Pitch, Through Hole, Solder Termination, Unshrouded, 3A, 30µin Gold Mating Finish
Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
All specifications
| Parameter | Value |
|---|---|
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 24 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.150\" (3.81mm) |
| Overall contact length | 0.480\" (12.19mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Product details
Frequently asked questions
What is the closest functional alternative to 68602-124HLF?
The 68602-116HLF is the closest peer in the same BERGSTIK® II series — same pitch, plating, and current rating, but with 16 positions instead of 24. If the BOM requires fewer circuits, that is a direct drop-in; for 24 positions, the 68602-124HLF is the only variant.
What is the mating connector for 68602-124HLF?
As an unshrouded 0.100" pitch header, it mates with standard IDC sockets, ribbon-cable receptacles, or board-to-board female headers that share the same 2-row, 0.100" pitch footprint.