Amphenol ICC (FCI) BERGSTIK® II series, 68602-170HLF, 70-position dual-row unshrouded header, 0.100" (2.54 mm) pitch, through-hole solder termination, male pin, gold or GXT™ plating, 3 A, -65°C to 130°C, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Parameter | Value |
|---|---|
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 70 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.150\" (3.81mm) |
| Overall contact length | 0.480\" (12.19mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 68602-170HLF: It is a through-hole solder termination, male pin, square contact style — a standard footprint for board-to-board and wire-to-board interconnect. The 70-position count is loaded fully — all positions are populated, so the BOM pinout matches the connector footprint without depopulation.
Common mates include BERGSTIK® II receptacle housings and IDC sockets with matching pitch and row spacing.
The 68602-170BLF is a sibling in the same BERGSTIK® II series with identical 70-position, 0.100" pitch, and through-hole termination. The primary difference is the contact finish — confirm the plating requirement before substituting.