Board Layout Fit: 0.100" Pitch, Dual-Row, Through-Hole
The 68602-428HLF: The 28 positions are loaded all the way across both rows, so the footprint is a simple 2×14 grid.
Current and Contact Life: Tin-Plated Signal Duty
Tin on the solder tail matches the mating finish, so no galvanic mismatch at the board joint.
Cross-Reference: 68602-428BLF vs 68602-428HLF
The 68602-428BLF is the same 28-position, dual-row, 0.100" pitch unshrouded header from the same BERGSTIK® II series. The difference is the plating: the BLF suffix typically carries a gold flash on the mating surface, while the HLF uses a full tin finish. For tin-to-tin mating with a tin receptacle, the HLF is the correct match; for gold-to-gold or mixed-plating systems, the BLF may be preferred.