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68602-464HLF — Amphenol product photo

Amphenol ICC (FCI) 68602-464HLF BergStik II Header

MPN68602-464HLF
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Amphenol ICC (FCI) BergStik® II header, order code 68602-464HLF, 64 positions, dual row, 0.100" (2.54 mm) pitch, 3 A, tin-plated mating contacts, through-hole, solder termination.

$8.3800Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

68602-464HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Current rating3A
Operating temperature-65°C~130°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions64
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.150\" (3.81mm)
Overall contact length0.480\" (12.19mm)
Contact finish - matingTin
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

64-circuit BergStik II board-to-board header

The 68602-464HLF is the 64-position member of the Amphenol ICC (FCI) BergStik® II unshrouded header line, a board-to-board connector with 0.100" (2.54 mm) pitch and dual rows spaced at the same 0.100". Rated 3 A per contact across a -65°C to 130°C operating range, with tin-plated mating contacts and through-hole solder termination.

Position count across the series

At 64 positions the 68602-464HLF sits at the upper end of the BergStik® II dual-row range — the pitch, row spacing, and unshrouded profile are shared across the series, so the board footprint stays constant; match the position count to the circuit count.