Board-to-Board Signal Interconnect with 36 Positions
Position Count and Pitch for BOM Fit
The 36-position layout with 0.100" row spacing gives a 1.8-inch board footprint — a dense but routable signal count for multi-line bus interfaces. Compared to the 26-position 68683-313LF or the 20-position 68683-310LF, this 36-position variant fits higher I/O count designs without changing the pitch or contact finish.
This part is RoHS non-compliant; for lead-free requirements, order the 68683-318LF sibling, which is identical in pitch, position count, and finish.
Housing and Contact Construction
Phosphor bronze contacts with tin-plated posts (100 µinch) and gold-plated mating surfaces (30 µinch) balance solderability with corrosion resistance at the interface. Push-pull fastening with a 0.115" (2.92mm) post length suits standard through-hole PCB thicknesses.