Board-to-Board Receptacle for Signal Interconnect
The 68685-308LF: The through-hole termination with 0.115" (2.92 mm) post length provides a robust solder joint for manual or wave-solder assembly, and the 100.0 µinch tin post finish ensures good solderability.
Thermal and Electrical Ratings for Harsh Environments
Rated for 1000 V, the 68685-308LF provides substantial isolation margin above typical signal or low-power bus voltages, suitable for equipment requiring reinforced insulation or transient withstand. The housing is molded from polyphenylene sulfide (PPS), a high-temperature thermoplastic that maintains dimensional stability and electrical insulation at the 125°C upper limit without creep or degradation.
Mating and Integration
The push-pull fastening type allows tool-less engagement and disengagement.